In order to assess device and circuit performances and to provide application teams with functional devices, packaging is a key technology for the III-V Lab.

Packages are first designed taking into account the specific thermal and electromagnetic requirements of the application. Using conventional Au wire or ribbon bonding, devices are packaged using thin film substrates with chip capacitors and resistors.

Optical coupling generally uses lensed fiber or micro-optics, with YAG welding for final assembly.